题目内容：

英语翻译
Within this paper the injection molding of regular parts with macroscopic size and micro-structures is investigated with regard to the use of different thermoplastic materials.First of all the negative surface structure has to be onto the mold wall.Using Microsystems technologies,the structures to be molded are applied to the mold wall by either additive or subtractive structuring processes.For structuring
the mold wall it is also very common to apply several processes.In the LIGA process,for instance,which is used for the manufacturing of CDs/DVDs,the negative of the surface structures is produced in a lithography process before it is copied on a nickel-shim by electroplating.For further details see (Despa et al.1999).Within this paper differently structured mold walls are applied for the validation
of the presented model.Therefore,a silicon substrate is used as mold wall with v-groove micro-structures.They are produced in an anisotropic etching process in h100i wafers.In h100i oriented wafers a masking is used in order to etch characteristic v-grooves and pyramidal pit shapes.The pyramidal pits have top edges oriented parallel and perpendicularly to the h110i direction (the major flat).Another kind of structured mold inserts which are analyzed consist of steel inserts precipitated with titanium aluminum nitride TiAlN or titanium dioxide TiO2 layers by a reactive magnetron sputtering technique.

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